Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.
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This type of packaging can also be divided into two main types: December Learn how and when to remove this template message. Potting can be done in a pre-molded potting shell, or directly in a mold. Molded plastic cases and structural pacjages can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly. Industrial design Packaging Packaging microfabrication Chip carriers.
Six Sigma: Hermeticity Testing
hermiticiity Liquid filling is sometimes used as an alternative to potting or impregnation. Another use is to protect deep-submergence items such as sonar transducers from collapsing under extreme pressure, by filling all voids. Curing can consist of polymerizing the internal resin or evaporating the solvent, which leaves an insulating dielectric material between different voltage components.
Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology. Glop-top is a variant of conformal coating used in chip-on-board assembly COB. The main application of vacuum impregnation porosity sealing is in boosting the dielectric strength of transformers, solenoids, lamination stacks or coils, and some high voltage components. This also excludes dirt and conductive contaminants such as impure water from sensitive areas.
An electronics assembly consists of component devices, circuit card assemblies CCAsconnectors, cables and components such as transformers, power supplies, relays, switches, etc.
Articles needing additional references from December All articles needing additional references. Some later tubes used metal cases and feedthroughs, and only the insulation around the individual feedthroughs used glass.
Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Packaging for aerospace, marine, or military systems imposes different types of design criteria. In some products, such as computer accessory boards, they’re all the structure there is. A designer must balance many objectives and practical considerations when selecting packaging methods.
See Conformal coatingParylene. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. The tool of choice is a numerically controlled vertical milling machine, with automatic translation of computer-aided design CAD files to toolpath command files. Formally called “encapsulation”, potting consists of immersing the part or assembly in a liquid resin, then curing it.
It consists of a drop of specially formulated epoxy  or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues packaegs could disrupt circuit operation.
Many electrical products require the manufacturing of high-volume, low-cost parts such as enclosures or covers by techniques such as injection molding, die casting, investment casting, and so on.
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Today it is most widely used to protect semiconductor components from moisture hegmiticity mechanical damage, and to serve as a mechanical structure holding the lead frame and the chip together.
Piece part costs are high, but there is little or no cost for custom tooling, and first-piece deliveries can take as little as half a day. Potting can be rigid or soft. The design of these products depends on the production method and require careful consideration of dimensions and paackages and tooling design. In the design of electronic products, electronic packaging engineers perform analyses to estimate such things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments.
Electronic packaging – Wikipedia
Retrieved from ” https: Porosity Sealing or Resin Impregnation is similar to potting, but doesn’t use a shell or a mold. Parts are submerged in a polymerizable monomer or solvent-based low viscosity plastic solution.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer.
From Wikipedia, the free encyclopedia. Views Read Edit View history. Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures. It can be mechanically strong, provides electromagnetic shielding when the product requires that feature, and is easily made for prototypes and small production runs with little custom tooling expense. Aluminum die castings are more common than iron or steel sand electronnic.
Such knowledge is important to prevent immediate or premature electronic product failures. Hermetic metal packaging began life in the vacuum tube industry, where a totally leak-proof housing was essential to operation. It’s relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor germiticity, etc.
Examples are injection molding, transfer molding, vacuum forming, and die cutting. Electronic packages are sometimes made by machining solid blocks of metal, usually aluminum, into complex shapes.
Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge.